Our company provides EMS/ODM services, covering PCB design, board copy & BOM copy, electronic component procurement, PCB production, patch, plug-in, assembly, filling procedure and finished product testing. Adopt ISO9001:2015 international quality management system & ISO14001 environmental protection system. The daily production capacity reaches 2 million points, IC/BGA can be mounted, the minimum IC pitch is 0.25mm, the BGA ball heel can reach 0.25mm, and the soldering technology (SMT solder paste technology and SMT red glue technology) is selected. The first piece is used for inspection, and the quality problem with AOI optical inspection equipment is effectively controlled and escorted in this link. Widely serve in various fields such as smart home, smart wearable devices, smart devices, Internet of Things, household appliances, computers, communications, optoelectronic instruments, industrial control & VR/AR/AI.
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Quality specification
Quality System: lSO9001:2015
Quality standard: IPC-610-G2 level
Welding standard: J-STD-001 1,2,3 level
Electrostatic protection standard: ESD-S20.20-2014
On-site management system: 8S
Lead-free requirements: RoHS2.0, halogen-free, REACH directive. -
Quality standard
The visual acceptance conditions of the company's product electronic component manufacturing and electronic assembly quality are: lPC-A-610D-G formulated by the IPC Assurance Committee